Spinning Circuit Systems Directly into Fibers! Woven Robotic Electronic Skin Becomes Possible
Release time:
2026-10-19
Can circuit systems be directly “spun” into the interior of flexible fibers? According to Science and Technology Daily, a team at Donghua University led by an academician of the Chinese Academy of Sciences has given an affirmative answer. The team innovatively proposed a microfluidic-encoded spinning technology that enables fiber formation and circuit construction to proceed simultaneously, allowing a complete circuit function to be integrated inside a single fiber. The related results were recently published in Nature Electronics.

The Integration Bottleneck of Traditional Flexible Electronics
The development of embodied intelligent equipment places higher demands on the deformation adaptability of electronic systems. Traditional rigid circuits are difficult to adapt to the complex curved surfaces and dynamic motion scenarios of robots; flexible fibers are lightweight, soft, bendable, and wearable, making them ideal carriers for flexible electronic integration.
However, for a long time, fiber electronics have mostly remained at the level of single sensing or light-emitting devices, making it difficult to simultaneously achieve material arrangement, device regulation, and stable electrical connections. System-level circuit integration faces challenges, restricting the commercialization of the technology.
“Writing” Circuit Design into the Spinning Process
To address this bottleneck, the research team abandoned traditional fabrication approaches and, relying on precise microfluidic fluid design, transformed circuit layouts, device structures, and interconnection logic into a programmable spinning process.
Specifically, the researchers regulated the parameters of multi-component spinning solutions—including conductive, insulating, semiconductor, and light-emitting materials—to construct layered functional structures in the fiber cross-section. At the same time, they dynamically adjusted the fluid input along the fiber length direction to achieve controllable arrangement of functional structures, completing orderly electrical connections between devices in one step, so that multiple functional circuits can be integrated in situ inside a single fiber.
According to the researchers, traditional flexible electronics mostly involve first fabricating fiber devices and then performing subsequent assembly, making it difficult to build continuous and reliable circuit systems inside fibers. This technology directly “writes” circuit design into the spinning process, allowing fiber formation and circuit construction to be completed simultaneously—this is its core innovation.
This method requires no complex mounting or soldering and, while achieving device integration, preserves the flexibility, weavability, and sewability of the fibers.
From Single Devices to System-Level Integration
Relying on this programmable spinning platform, the team achieved systematic fiber circuit integration: they constructed modules for color electroluminescence, analog signal processing, digital logic operations, and non-contact spatial perception, and interconnected devices such as transistors, resistors, and capacitors according to design, realizing functions including tunable filter circuits and inverters within a single fiber. This provides an expandable circuit foundation for subsequently combining more sensing and processing functions.
Application validation experiments confirmed the practical value of the technology. The research team placed spatial perception fibers on the inner side of a robotic arm gripper. The approach or movement of a target caused changes in electric field coupling, and the supporting system calculated the target position accordingly and drove the robotic arm to achieve automatic target tracking. In another set of experiments, the team used a flexible interactive interface composed of fibers and a supporting system to enable non-contact control of a robotic arm and a drone by finger movements.
Connecting the Technology Chain from Materials and Devices to Systems
Industry insiders said that the core value of this research lies in establishing a new manufacturing method spanning material regulation, microstructure construction, and integrated circuit integration, connecting the technology chain of fiber electronics from materials and devices to systems and breaking the limitations of traditional circuit forms.
The results provide a new underlying technology path for the development of embodied intelligent perception, flexible human-machine interaction, and soft robotics, and are expected to promote the flexible electronics industry from single-point innovation toward systematic application.
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